Collaboration enables SoC manufacturers to improve their qualification envelope to achieve lifetime reliability, shorten their root cause analysis time, and reduce operational costs HAIFA, ...

As industry standards race to keep pace with rapidly evolving AI technology, open questions remain around how reliability is ...

Technology loves order. Software structures - and indeed hardware systems and miroprocessor chipset architectures - work best when they are shaped to a defined order, when they align to a codified ...

This report responds to a request from the U.S. Department of Defense (DOD) to identify engineering practices that have proved successful for system development and testing in industrial environments.

Suppliers of gallium nitride (GaN) and silicon carbide (SiC) power devices are rolling out the next wave of products with some new and impressive specs. But before these devices are incorporated in ...

Hardware-in-the-loop (HIL) testing involves simulation of power plant behavior using the actual site-specific power plant controls before the commissioning stage. HIL testing can benefit all project ...

Chipmakers are increasingly turning to advanced packaging to overcome the reticle size limit of silicon manufacturing without increasing transistor density. This method also allows hybrid devices with ...

Environmental and qualification testing play a critical role in this process. As device geometries shrink and packaging technologies become more complex, environmental stress testing provides a ...

http://www.maxwell.comSystem reliability concerns are imperative to the implementation of today's broadband wireless infrastructure. Wireless networks require new ...

A material’s hardness relates to its mechanical resistance when subjected to mechanical indentation by another harder body. Diamond is considered the hardest natural material and is typically used for ...